Industrial laser applications focus on high-precision and high-quality machining with minimal thermal impact. These lasers are primarily used for:
The document outlines several technological advantages that make these lasers ideal for industrial environments:
| Industrial Application | Laser Beam Type / Technology |
| PCB & Display Panel Processing |
UV and Solid-state lasers for cutting/drilling |
| Semiconductor Substrate Machining |
3rd/4th generation substrate dicing and drilling machines |
| Solar Cell Manufacturing (PSCs/BC) |
High-power Picosecond UV Lasers (355nm) |
| Photovoltaic Film Processing |
Conductive/non-conductive layer ablation |
| Toolmaking and High-Power Machining |
High-energy Short-pulse ZIG-ZAG Slab Lasers |
Based on the product specifications, here is how the specialized laser sources compare to standard industrial requirements:
| Feature | Standard Industrial Lasers | Advanced ps-Inno/UV Slab Technology |
| Average Power | Varies |
≥ 500 W (Slab Source) to 1000 W (ZIG-ZAG) |
| Pulse Width | Nanosecond/Millisecond |
∼10 ps (Picosecond) for ultrashort processing |
| Beam Quality ($M^2$) | Standard focus |
< 1.2 to 1.5 for high-precision dicing |
| Power Stability | Moderate |
< 2 RMS over 8–10 hours |
| Control Mode | Manual/Basic | IPC, Gate, and Trigger control for automated lines |
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